產品介紹
EFEM 整合系統
●FOUP 自動LUL
●對應多種產品 Panel/Wafer/Compound/Glass/Metal carrier Transfer
●使用Non-Contact Alignment精準補正對位
●對應MAX WARPAGE±12mm產品進行移載
●移載產品vibration≦0.3G
●上下游製程INLINE串接
●對應多種產品 Panel/Wafer/Compound/Glass/Metal carrier Transfer
●使用Non-Contact Alignment精準補正對位
●對應MAX WARPAGE±12mm產品進行移載
●移載產品vibration≦0.3G
●上下游製程INLINE串接
●General
Dimension (2 Loadport)：(W)2530 x (L)3000 x (H)2315 mm
Dimension (4 Loadport)：(W)2530 x (L)4670 x (H)2315 mm
Weight：220~300kg
Panel/Wafer Transfer Size：300x300 ~ 625x625 mm
FOUP Loader：2 pcs/ 4 pcs
SECS/GEM：GEM200 / GEM300
●Power
控制系統負載：3P 208 VAC 50/60 Hz；75A
●Non-Contact Alignment Ability
Detection Range：±12mm
Detection Accuracy：±0.2mm
●Transfer
Product Size：300x300 ~ 625x625 mm
Product Type ：Compound / Metal / Glass
UPH：100 pcs/hr
X Axis Accuracy：±0.2mm
Robot Y Axis Accuracy：±0.2mm
Robot Z Axis Accuracy：±0.2mm
●Quality
ESD：< 25V
無塵等級：符合FS209 Class 100等級
Vibration：≦0.3G (RMS.)
●Safety
SEMI 認證：符合SEMI S2、S8、S10認證
設備結構認證：符合SEMI規範
Dimension (2 Loadport)：(W)2530 x (L)3000 x (H)2315 mm
Dimension (4 Loadport)：(W)2530 x (L)4670 x (H)2315 mm
Weight：220~300kg
Panel/Wafer Transfer Size：300x300 ~ 625x625 mm
FOUP Loader：2 pcs/ 4 pcs
SECS/GEM：GEM200 / GEM300
●Power
控制系統負載：3P 208 VAC 50/60 Hz；75A
●Non-Contact Alignment Ability
Detection Range：±12mm
Detection Accuracy：±0.2mm
●Transfer
Product Size：300x300 ~ 625x625 mm
Product Type ：Compound / Metal / Glass
UPH：100 pcs/hr
X Axis Accuracy：±0.2mm
Robot Y Axis Accuracy：±0.2mm
Robot Z Axis Accuracy：±0.2mm
●Quality
ESD：< 25V
無塵等級：符合FS209 Class 100等級
Vibration：≦0.3G (RMS.)
●Safety
SEMI 認證：符合SEMI S2、S8、S10認證
設備結構認證：符合SEMI規範
