產品介紹
Laser Cutting and Patterning
● 各種膜薄材料雷射切割(移除)及圖案化修補
● 搭配EFEM及非接觸式對位系統可精準傳輸複合材質、玻璃及金屬載體等各式材料的面板及晶圓尺寸規格
● 搭載AOI及3D量測達到快速自動化且精準缺陷檢測
● 雷射搭載同軸影像，達到高精度雷射修補、降低基板損傷、即時圖案化雷射加工
● 搭配EFEM及非接觸式對位系統可精準傳輸複合材質、玻璃及金屬載體等各式材料的面板及晶圓尺寸規格
● 搭載AOI及3D量測達到快速自動化且精準缺陷檢測
● 雷射搭載同軸影像，達到高精度雷射修補、降低基板損傷、即時圖案化雷射加工
● General
Dimension/Weight (Wafer Form)：(W)1700 x (L)2500 x (H)2240 mm / 4600kg
Dimension/Welght (Panel Form)：(W)3500 x (L)3700 x (H)2240 mm / 8500kg
Wafer/Panel Transfer Size：300x300 ~ 600x600 mm
Stage accuracy ：≦ 2μm
Stage repeatability：≦ 1μm
Stage max velocity：800mm/s
● Process Capability
Laser type：Nanosecond laser
Process material*：Metal film / ITO / Photoresist / Polymer / Compound
Line/Space (L/S)*：> 2μm/ 2μm
● Inspection Capability
Inspection Item：Aperture, Residual, Displacement, Depth
Inspection size：≧ 5μm
3D Depth resolution ：0.3 μm
3D Width resolution ：0.2 μm
● Depend on the characteristic of material and substrate.
Dimension/Weight (Wafer Form)：(W)1700 x (L)2500 x (H)2240 mm / 4600kg
Dimension/Welght (Panel Form)：(W)3500 x (L)3700 x (H)2240 mm / 8500kg
Wafer/Panel Transfer Size：300x300 ~ 600x600 mm
Stage accuracy ：≦ 2μm
Stage repeatability：≦ 1μm
Stage max velocity：800mm/s
● Process Capability
Laser type：Nanosecond laser
Process material*：Metal film / ITO / Photoresist / Polymer / Compound
Line/Space (L/S)*：> 2μm/ 2μm
● Inspection Capability
Inspection Item：Aperture, Residual, Displacement, Depth
Inspection size：≧ 5μm
3D Depth resolution ：0.3 μm
3D Width resolution ：0.2 μm
● Depend on the characteristic of material and substrate.
